 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| IPD50N06S3-09 OptiMOS(R)-T Power-Transistor Product Summary V DS R DS(on),max ID 55 9.0 50 V m A Features * N-channel - Normal Level - Enhancement mode * Automotive AEC Q101 qualified * MSL1 up to 260C peak reflow * 175C operating temperature * Green package (RoHS compliant) * Ultra low Rds(on) * 100% Avalanche tested PG-TO252-3-11 Type IPD50N06S3-09 Package PG-TO252-3-11 Marking 3N0609 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current1) Symbol ID Conditions T C=25 C, V GS=10 V T C=100 C, V GS=10 V2) Pulsed drain current2) Avalanche energy, single pulse2) Avalanche current, single pulse Gate source voltage3) Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 I D,pulse E AS I AS V GS P tot T j, T stg T C=25 C T C=25 C I D=25 A Value 50 50 200 370 50 20 107 -55 ... +175 55/175/56 mJ A V W C Unit A Rev. 1.1 page 1 2009-05-20 IPD50N06S3-09 Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics2) Thermal resistance, junction - case SMD version, device on PCB R thJC R thJA minimal footprint 6 cm2 cooling area4) Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D= 1 mA V GS(th) I DSS V DS=V GS, I D=55 A V DS=55 V, V GS=0 V, T j=25 C V DS=55 V, V GS=0 V, T j=125 C2) Gate-source leakage current Drain-source on-state resistance I GSS RDS(on) V GS=20 V, V DS=0 V V GS=10 V, I D=43 A 55 2.1 3.0 0.01 4 1 A V 1.4 62 40 K/W - 1 1 8.0 100 100 9 nA m Rev. 1.1 page 2 2009-05-20 IPD50N06S3-09 Parameter Symbol Conditions min. Values typ. max. Unit Dynamic characteristics2) Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics2) Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode continous forward current2) Diode pulse current2) Diode forward voltage Reverse recovery time2) Reverse recovery charge2) 1) C iss C oss Crss t d(on) tr t d(off) tf V DD=27.5 V, V GS=10 V, I D=50 A, R G=5.1 V GS=0 V, V DS=25 V, f =1 MHz - 5340 810 780 23 42 26 37 6140 1220 1170 - pF ns Q gs Q gd Qg V plateau V DD=11 V, I D=50 A, V GS=0 to 10 V - 34 20 77 6.3 45 30 90 - nC V IS I S,pulse V SD t rr Q rr T C=25 C V GS=0 V, I F=50 A, T j=25 C V R=27.5 V, I F=I S, di F/dt =100 A/s 0.6 - 0.9 40 50 50 200 1.3 - A V ns nC Current is limited by bondwire; with an R thJC = 1.4 K/W the chip is able to carry 81 A at 25C. For detailed information see Application Note ANPS071E. 2) Defined by design. Not subject to production test. 3) Qualified at -5V and +20V. 4) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.1 page 3 2009-05-20 IPD50N06S3-09 1 Power dissipation P tot = f(T C); V GS 6 V 2 Drain current I D = f(T C); V GS 6 V 120 60 100 50 80 40 P tot [W] 60 I D [A] 0 50 100 150 200 30 40 20 20 10 0 0 0 50 100 150 200 T C [C] T C [C] 3 Safe operating area I D = f(V DS); T C = 25 C; D = 0 parameter: t p 1000 4 Max. transient thermal impedance Z thJC = f(t p) parameter: D =t p/T 101 1 s 100 10 s 0.5 100 1 ms 100 s Z thJC [K/W] 0.1 I D [A] 10-1 0.05 10 10-2 0.01 single pulse 1 0.1 1 10 100 10-3 10-7 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 1.1 page 4 2009-05-20 IPD50N06S3-09 5 Typ. output characteristics I D = f(V DS); T j = 25 C parameter: V GS 200 175 150 8V 10 V 6 Typ. drain-source on-state resistance R DS(on) = f(I D); T j = 25 C parameter: V GS 20 6V 7V 8V 15 100 75 50 7.5 V R DS(on) [m] 125 I D [A] 9V 7V 10 6.5 V 10 V 6V 25 0 0 2 4 5.5 V 5 6 8 10 0 50 100 150 V DS [V] I D [A] 7 Typ. transfer characteristics I D = f(V GS); V DS = 6 V parameter: T j 160 -55 C 8 Typ. drain-source on-state resistance R DS(on) = f(T j); I D = 43 A; V GS = 10 V 16 140 25 C 14 120 100 175 C 12 80 60 40 R DS(on) [m] 0 2 4 6 8 10 I D [A] 10 8 6 20 0 4 -60 -20 20 60 100 140 180 V GS [V] T j [C] Rev. 1.1 page 5 2009-05-20 IPD50N06S3-09 9 Typ. gate threshold voltage V GS(th) = f(T j); V GS = V DS parameter: I D 4 10 Typ. capacitances C = f(V DS); V GS = 0 V; f = 1 MHz 104 Ciss 3.5 Coss 3 600A Crss V GS(th) [V] 60A C [pF] 2.5 103 2 1.5 1 -60 -20 20 60 100 140 180 102 0 5 10 15 20 25 T j [C] V DS [V] 11 Typical forward diode characteristicis IF = f(VSD) parameter: T j 103 12 Typ. avalanche characteristics I AV = f(t AV) parameter: T j(start) 100 25C 100C 150C 102 I AV [A] 101 175 C 25 C I F [A] 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1 1 10 100 1000 V SD [V] t AV [s] Rev. 1.1 page 6 2009-05-20 IPD50N06S3-09 13 Typical avalanche Energy E AS = f(T j) parameter: I D 800 12.5 A 14 Drain-source breakdown voltage V BR(DSS) = f(T j); I D = 1 mA 65 600 60 V BR(DSS) [V] E AS [mJ] 400 25 A 55 200 50 A 50 0 0 50 100 150 200 45 -60 -20 20 60 100 140 180 T j [C] T j [C] 15 Typ. gate charge V GS = f(Q gate); I D = 50 A pulsed parameter: V DD 12 16 Gate charge waveforms V GS Qg 11 V 44 V 10 8 V plateau V GS [V] 6 V g s(th) 4 2 Q g (th) Q gs 0 50 100 150 Q sw Q gd Q gate 0 Q gate [nC] Rev. 1.1 page 7 2009-05-20 IPD50N06S3-09 Published by Infineon Technologies AG 81726 Munich, Germany (c) Infineon Technologies AG 2009 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.1 page 8 2009-05-20 IPD50N06S3-09 Revision History Version Date Changes Correction of marking and update 15.06.2009 of disclaimer Data Sheet version 1.1 Data Sheet version 1.1 15.06.2009 Correction of package name Rev. 1.1 page 9 2009-05-20 |
Price & Availability of IPD50N06S3-09
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |